Lakefield: Hybrid cores in 3D Package

Sanjeev Khushu, Wilfred Gomes. Lakefield: Hybrid cores in 3D Package. In 2019 IEEE Hot Chips 31 Symposium (HCS), Cupertino, CA, USA, August 18-20, 2019. pages 1-20, IEEE, 2019. [doi]

Abstract

Abstract is missing.