Abstract is missing.
- TeraPHY: A Chiplet Technology for Low-Power, High-Bandwidth in-Package Optical I/OMark Wade. [doi]
- ML Benchmark Design ChallengesPeter Mattson. 1-36 [doi]
- Deep Learning Training At Scale Spring Crest Deep Learning Accelerator (Intel® Nervana™ NNP-T)Andrew Yang. 1-20 [doi]
- The true Processing In Memory acceleratorFabrice Devaux. 1-24 [doi]
- CYW89459: High Performance and Low Power Wi-Fi and Bluetooth 5.1 Combo Chip for IoT and AutomotiveKamesh Medepalli. 1-18 [doi]
- Gen-Z Chipsetfor Exascale FabricsPatrick Knebel, Dan Berkram, Al Davis, Darel Emmot, Paolo Faraboschi, Gary Gostin. 1-22 [doi]
- IC Technology - What Will the Next Node Offer Us?H.-S. Philip Wong, R. Willard, Inez Kerr Bell. 1-52 [doi]
- AMD "ZEN 2"David Suggs, Dan Bouvier, Michael Clark, Kevin Lepak, Mahesh Subramony. 1-24 [doi]
- A 0.11 PJ/OP, 0.32-128 Tops, Scalable Multi-Chip-Module-Based Deep Neural Network Accelerator Designed with A High-Productivity vlsi MethodologyRangharajan Venkatesan, Yakun Sophia Shao, Brian Zimmer, Jason Clemons, Matthew Fojtik, Nan Jiang, Ben Keller, Alicia Klinefelter, Nathaniel Ross Pinckney, Priyanka Raina, Stephen G. Tell, Yanqing Zhang, William J. Dally, Joel S. Emer, C. Thomas Gray, Stephen W. Keckler, Brucek Khailany. 1-24 [doi]
- Xilinx First 7nm Device: Versal AI Core (VC1902)Sagheer Ahmad, Sridhar Subramanian, Vamsi Boppana, Shankar Lakka, Fu-Hing Ho, Tomai Knopp, Juanjo Noguera, Gaurav Singh, Ralph Wittig. 1-28 [doi]
- 7NM "NAVI" GPU - A GPU Built for Performance and EfficiencyMike Mantor. 1-28 [doi]
- Hot Chips 2019Eitan Medina. 1-29 [doi]
- Spring Hill (NNP-I 1000) Intel's Data Center Inference ChipOfri Wechsler, Michael Behar, Bharat Daga. 1-12 [doi]
- Delivering the Future of High-Performance ComputingLisa Su. 1-43 [doi]
- Ouroboros: An Inference Engine for Deep Learning Based TTS on Embedded DevicesJiansong Zhang, Lixue Xia, Zhao Jiang, Hao Liang, Jiaoyan Chen, Shouda Liu, Wei Lin, Yuan Xie. 1-28 [doi]
- Silicon at the Heart of HoloLens 2Elene Terry. 1-26 [doi]
- Arm Neoverse N1 Cloud-to-Edge Infrastructure SoCsAndrea Pellegrini, Chris Abernathy. 1-21 [doi]
- Computer and Redundancy Solution for the Full Self-Driving ComputerPete Bannon, Ganesh Venkataramanan, Debjit Das Sarma, Emil Talpes. 1-22 [doi]
- Zion: Facebook Next- Generation Large Memory Training PlatformMisha Smelyanskiy. 1-22 [doi]
- IBM's Next Generation POWER ProcessorJeff Stuecheli, Scott Willenborg, William J. Starke. 1-19 [doi]
- DaVinci: A Scalable Architecture for Neural Network ComputingHeng Liao, Jiajin Tu, Jing Xia, Xiping Zhou. 1-44 [doi]
- Lakefield: Hybrid cores in 3D PackageSanjeev Khushu, Wilfred Gomes. 1-20 [doi]
- RTX ON - The NVIDIA TURING GPUJohn Burgess. 1-27 [doi]
- Jintide®: A Hardware Security Enhanced Server CPU with Xeon® Cores under Runtime Surveillance by an In-Package Dynamically Reconfigurable ProcessorLeibo Liu, Ao Luo, Guanhua Li, Jianfeng Zhu, Yong Wang, Gang Shan, Jianfeng Pan, Shouyi Yin, Shaojun Wei. 1-25 [doi]
- A Programmable Embedded Microprocessor for Bit-scalable In-memory ComputingHongyang Jia, Hossein Valavi, Yinqi Tang, Jintao Zhang, Naveen Verma. 1-29 [doi]