Fast chip-package-PCB coanalysis methodology for power integrity of multi-domain high-speed memory: A case study

Seungwon Kim, Ki Jin Han, Youngmin Kim, Seokhyeong Kang. Fast chip-package-PCB coanalysis methodology for power integrity of multi-domain high-speed memory: A case study. In 2018 Design, Automation & Test in Europe Conference & Exhibition, DATE 2018, Dresden, Germany, March 19-23, 2018. pages 885-888, IEEE, 2018. [doi]

Abstract

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