Jonghoon J. Kim, Heegon Kim, Sukjin Kim, Bumhee Bae, Daniel H. Jung, Sunkyu Kong, Joungho Kim, Junho Lee, Kunwoo Park. Design of contactless wafer-level TSV connectivity testing structure using capacitive coupling. In 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits, EMC Compo 2013, Nara, Japan, December 15-18, 2013. pages 158-162, IEEE, 2013. [doi]
Abstract is missing.