Impact of nano-scale through-silicon vias on the quality of today and future 3D IC designs

Daehyun Kim, Suyoun Kim, Sung Kyu Lim. Impact of nano-scale through-silicon vias on the quality of today and future 3D IC designs. In Janet Meiling Wang, Deming Chen, editors, 2011 International Workshop on System Level Interconnect Prediction, SLIP 2011, San Diego, CA, USA, June 5, 2011. pages 1-8, IEEE, 2011. [doi]

Abstract

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