An ECC-Assisted Postpackage Repair Methodology in Main Memory Systems

Dae-Hyun Kim, Linda Milor. An ECC-Assisted Postpackage Repair Methodology in Main Memory Systems. IEEE Trans. VLSI Syst., 25(7):2045-2058, 2017. [doi]

@article{KimM17-6,
  title = {An ECC-Assisted Postpackage Repair Methodology in Main Memory Systems},
  author = {Dae-Hyun Kim and Linda Milor},
  year = {2017},
  doi = {10.1109/TVLSI.2017.2671790},
  url = {http://doi.ieeecomputersociety.org/10.1109/TVLSI.2017.2671790},
  researchr = {https://researchr.org/publication/KimM17-6},
  cites = {0},
  citedby = {0},
  journal = {IEEE Trans. VLSI Syst.},
  volume = {25},
  number = {7},
  pages = {2045-2058},
}