TSV-Aware Interconnect Distribution Models for Prediction of Delay and Power Consumption of 3-D Stacked ICs - researchr publication

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Daehyun Kim, Saibal Mukhopadhyay, Sung Kyu Lim. TSV-Aware Interconnect Distribution Models for Prediction of Delay and Power Consumption of 3-D Stacked ICs. IEEE Trans. on CAD of Integrated Circuits and Systems, 33(9):1384-1395, 2014. [doi]

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