Miniaturized and high-performance RF packages with ultra-thin glass substrates

Min Suk Kim, Markondeya Raj Pulugurtha, YoungWoo Kim, Gapyeol Park, Kyungjun Cho, Vanessa Smet, Venky Sundaram, Joungho Kim, Rao R. Tummala. Miniaturized and high-performance RF packages with ultra-thin glass substrates. Microelectronics Journal, 77:66-72, 2018. [doi]

Abstract

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