Soon-Wook Kim, Lan Peng, Andy Miller, Gerald Beyer, Eric Beyne, Chung-Sun Lee. Permanent wafer bonding in the low temperature by using various plasma enhanced chemical vapour deposition dielectrics. In 2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015. IEEE, 2015. [doi]
Abstract is missing.