Dae-Hyun Kim, Rasit Onur Topaloglu, Sung Kyu Lim. TSV density-driven global placement for 3D stacked ICs. In International SoC Design Conference, ISOCC 2011, Jeju, South Korea, November 17-18, 2011. pages 135-138, IEEE, 2011. [doi]
Abstract is missing.