In-situ Monitoring Hydrodynamic Pressure Distribution during Chemical Mechanical Polishing - researchr publication authors

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Eungchul Kim, Gunhoo Woo, Taesung Kim. In-situ Monitoring Hydrodynamic Pressure Distribution during Chemical Mechanical Polishing. In 2nd Workshop on Metrology for Industry 4.0 and IoT MetroInd4.0&IoT 2019, Naples, Italy, June 4-6, 2019. pages 235-239, IEEE, 2019. [doi]

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