Eungchul Kim, Gunhoo Woo, Taesung Kim. In-situ Monitoring Hydrodynamic Pressure Distribution during Chemical Mechanical Polishing. In 2nd Workshop on Metrology for Industry 4.0 and IoT MetroInd4.0&IoT 2019, Naples, Italy, June 4-6, 2019. pages 235-239, IEEE, 2019. [doi]
@inproceedings{KimWK19,
title = {In-situ Monitoring Hydrodynamic Pressure Distribution during Chemical Mechanical Polishing},
author = {Eungchul Kim and Gunhoo Woo and Taesung Kim},
year = {2019},
doi = {10.1109/METROI4.2019.8792840},
url = {https://doi.org/10.1109/METROI4.2019.8792840},
researchr = {https://researchr.org/publication/KimWK19},
cites = {0},
citedby = {0},
pages = {235-239},
booktitle = {2nd Workshop on Metrology for Industry 4.0 and IoT MetroInd4.0&IoT 2019, Naples, Italy, June 4-6, 2019},
publisher = {IEEE},
isbn = {978-1-7281-0429-4},
}