Eungchul Kim, Gunhoo Woo, Taesung Kim. In-situ Monitoring Hydrodynamic Pressure Distribution during Chemical Mechanical Polishing. In 2nd Workshop on Metrology for Industry 4.0 and IoT MetroInd4.0&IoT 2019, Naples, Italy, June 4-6, 2019. pages 235-239, IEEE, 2019. [doi]
Abstract is missing.