A quantitative analysis of performance benefits of 3D die stacking on mobile and embedded SoC - researchr publication authors

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Dongki Kim, Sungjoo Yoo, Sunggu Lee, Jung Ho Ahn, Hyunuk Jung. A quantitative analysis of performance benefits of 3D die stacking on mobile and embedded SoC. In Design, Automation and Test in Europe, DATE 2011, Grenoble, France, March 14-18, 2011. pages 1333-1338, IEEE, 2011. [doi]

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