Dongki Kim, Sungjoo Yoo, Sunggu Lee, Jung Ho Ahn, Hyunuk Jung. A quantitative analysis of performance benefits of 3D die stacking on mobile and embedded SoC. In Design, Automation and Test in Europe, DATE 2011, Grenoble, France, March 14-18, 2011. pages 1333-1338, IEEE, 2011. [doi]
@inproceedings{KimYLAJ11,
title = {A quantitative analysis of performance benefits of 3D die stacking on mobile and embedded SoC},
author = {Dongki Kim and Sungjoo Yoo and Sunggu Lee and Jung Ho Ahn and Hyunuk Jung},
year = {2011},
url = {http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=5763214},
researchr = {https://researchr.org/publication/KimYLAJ11},
cites = {0},
citedby = {0},
pages = {1333-1338},
booktitle = {Design, Automation and Test in Europe, DATE 2011, Grenoble, France, March 14-18, 2011},
publisher = {IEEE},
isbn = {978-1-61284-208-0},
}