Micro-bumping, Hybrid Bonding, or Monolithic? A PPA Study for Heterogeneous 3D IC Options - researchr publication authors

researchr

You are not signed in
Sign in
Sign up

Jinwoo Kim, Lingjun Zhu, Hakki Mert Torun, Madhavan Swaminathan, Sung Kyu Lim. Micro-bumping, Hybrid Bonding, or Monolithic? A PPA Study for Heterogeneous 3D IC Options. In 58th ACM/IEEE Design Automation Conference, DAC 2021, San Francisco, CA, USA, December 5-9, 2021. pages 1189-1194, IEEE, 2021. [doi]

This author has not been identified. Look up 'Jinwoo Kim' in GoogleThis author has not been identified. Look up 'Lingjun Zhu' in GoogleThis author has not been identified. Look up 'Hakki Mert Torun' in GoogleThis author has not been identified. Look up 'Madhavan Swaminathan' in GoogleThis author has not been identified. Look up 'Sung Kyu Lim' in Google

runs on WebDSL