Jinwoo Kim, Lingjun Zhu, Hakki Mert Torun, Madhavan Swaminathan, Sung Kyu Lim. Micro-bumping, Hybrid Bonding, or Monolithic? A PPA Study for Heterogeneous 3D IC Options. In 58th ACM/IEEE Design Automation Conference, DAC 2021, San Francisco, CA, USA, December 5-9, 2021. pages 1189-1194, IEEE, 2021. [doi]
Abstract is missing.