Armin Klumpp, Peter Ramm, R. Wieland. 3D-integration of silicon devices: A key technology for sophisticated products. In Design, Automation and Test in Europe, DATE 2010, Dresden, Germany, March 8-12, 2010. pages 1678-1683, IEEE, 2010. [doi]
@inproceedings{KlumppRW10,
title = {3D-integration of silicon devices: A key technology for sophisticated products},
author = {Armin Klumpp and Peter Ramm and R. Wieland},
year = {2010},
url = {http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=5457085},
researchr = {https://researchr.org/publication/KlumppRW10},
cites = {0},
citedby = {0},
pages = {1678-1683},
booktitle = {Design, Automation and Test in Europe, DATE 2010, Dresden, Germany, March 8-12, 2010},
publisher = {IEEE},
}