Large-Scale 3D Chips: Challenges and Solutions for Design Automation, Testing, and Trustworthy Integration

Johann Knechtel, Ozgur Sinanoglu, Ibrahim Abe M. Elfadel, Jens Lienig, Cliff C. N. Sze. Large-Scale 3D Chips: Challenges and Solutions for Design Automation, Testing, and Trustworthy Integration. IPSJ T. on System LSI Design Methodology, 10:45-62, 2017. [doi]

Abstract

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