Keng Huat Koh, R. M. Kuppan Chetty, S. G. Ponnambalam. Modeling and simulation of Electrostatic Adhesion for Wall Climbing Robot. In 2011 IEEE International Conference on Robotics and Biomimetics, ROBIO 2011, Karon Beach, Thailand, December 7-11, 2011. pages 2031-2036, IEEE, 2011. [doi]
Abstract is missing.