Signal integrity analysis of heterogeneous integration using Si bridge technology

Yong-Nam Koh, Ju-Hyung Kim, Soo-jeong Kim, Ju-Hwan Jang, Jae-Sung Lim, Jayden Donghyun Kim. Signal integrity analysis of heterogeneous integration using Si bridge technology. In 20th International SoC Design Conference, ISOCC 2023, Jeju, Republic of Korea, October 25-28, 2023. pages 221-222, IEEE, 2023. [doi]

Abstract

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