Kazuo Kondo, Shingo Mukahara, Masayuki Yokoi, Jin Onuki. No pumping at 450°C with electrodeposited copper TSV. In 2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015. IEEE, 2015. [doi]
Abstract is missing.