Supply current testing of open defects at interconnects in 3D Ics with IEEE 1149.1 architecture - researchr publication authors

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Tomoaki Konishi, Hiroyuki Yotsuyanagi, Masaki Hashizume. Supply current testing of open defects at interconnects in 3D Ics with IEEE 1149.1 architecture. In Mitsumasa Koyanagi, Morihiro Kada, editors, 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012. pages 1-6, IEEE, 2011. [doi]

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