Tomoaki Konishi, Hiroyuki Yotsuyanagi, Masaki Hashizume. Supply current testing of open defects at interconnects in 3D Ics with IEEE 1149.1 architecture. In Mitsumasa Koyanagi, Morihiro Kada, editors, 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012. pages 1-6, IEEE, 2011. [doi]
@inproceedings{KonishiYH11,
title = {Supply current testing of open defects at interconnects in 3D Ics with IEEE 1149.1 architecture},
author = {Tomoaki Konishi and Hiroyuki Yotsuyanagi and Masaki Hashizume},
year = {2011},
doi = {10.1109/3DIC.2012.6262968},
url = {http://dx.doi.org/10.1109/3DIC.2012.6262968},
researchr = {https://researchr.org/publication/KonishiYH11},
cites = {0},
citedby = {0},
pages = {1-6},
booktitle = {2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012},
editor = {Mitsumasa Koyanagi and Morihiro Kada},
publisher = {IEEE},
isbn = {978-1-4673-2189-1},
}