Tomohiro Korikawa, Akio Kawabata, Fujun He, Eiji Oki. Packet Processing Architecture With Off-Chip LLC Using Interleaved 3D-Stacked DRAM. In 20th IEEE International Conference on High Performance Switching and Routing, HPSR 2019, Xi'an, China, May 26-29, 2019. pages 1-6, IEEE, 2019. [doi]
@inproceedings{KorikawaKHO19-0,
title = {Packet Processing Architecture With Off-Chip LLC Using Interleaved 3D-Stacked DRAM},
author = {Tomohiro Korikawa and Akio Kawabata and Fujun He and Eiji Oki},
year = {2019},
doi = {10.1109/HPSR.2019.8807993},
url = {https://doi.org/10.1109/HPSR.2019.8807993},
researchr = {https://researchr.org/publication/KorikawaKHO19-0},
cites = {0},
citedby = {0},
pages = {1-6},
booktitle = {20th IEEE International Conference on High Performance Switching and Routing, HPSR 2019, Xi'an, China, May 26-29, 2019},
publisher = {IEEE},
isbn = {978-1-7281-1686-0},
}