M. Kraatz, Christoph Sander, André Clausner, M. Hauschildt, Yvonne Standke, Martin Gall, Ehrenfried Zschech. Analysis of electromigration-induced backflow stresses in Cu(Mn) interconnects using high statistical sampling. In IEEE International Reliability Physics Symposium, IRPS 2018, Burlingame, CA, USA, March 11-15, 2018. pages 4, IEEE, 2018. [doi]
@inproceedings{KraatzSCHSGZ18,
title = {Analysis of electromigration-induced backflow stresses in Cu(Mn) interconnects using high statistical sampling},
author = {M. Kraatz and Christoph Sander and André Clausner and M. Hauschildt and Yvonne Standke and Martin Gall and Ehrenfried Zschech},
year = {2018},
doi = {10.1109/IRPS.2018.8353598},
url = {https://doi.org/10.1109/IRPS.2018.8353598},
researchr = {https://researchr.org/publication/KraatzSCHSGZ18},
cites = {0},
citedby = {0},
pages = {4},
booktitle = {IEEE International Reliability Physics Symposium, IRPS 2018, Burlingame, CA, USA, March 11-15, 2018},
publisher = {IEEE},
isbn = {978-1-5386-5479-8},
}