Local stress analysis on semiconductor devices by combined experimental-numerical procedure

Rene Kregting, Sander Gielen, Willem D. van Driel, Paul Alkemade, Hozan Miro, Jan-Dirk Kamminga. Local stress analysis on semiconductor devices by combined experimental-numerical procedure. Microelectronics Reliability, 51(6):1092-1096, 2011. [doi]

@article{KregtingGDAMK11,
  title = {Local stress analysis on semiconductor devices by combined experimental-numerical procedure},
  author = {Rene Kregting and Sander Gielen and Willem D. van Driel and Paul Alkemade and Hozan Miro and Jan-Dirk Kamminga},
  year = {2011},
  doi = {10.1016/j.microrel.2011.03.010},
  url = {http://dx.doi.org/10.1016/j.microrel.2011.03.010},
  tags = {analysis},
  researchr = {https://researchr.org/publication/KregtingGDAMK11},
  cites = {0},
  citedby = {0},
  journal = {Microelectronics Reliability},
  volume = {51},
  number = {6},
  pages = {1092-1096},
}