Gokul Krishnan, Gopikrishnan Raveendran Nair, Jonghyun Oh, Anupreetham Anupreetham, Pragnya Sudershan Nalla, Ahmed Hassan, Injune Yeo, Kishore Kasichainula, Jae-sun Seo, Mingoo Seok, Yu Cao. 3D-ISC: A 65nm 3D Compatible In-Sensor Computing Accelerator with Reconfigurable Tile Architecture for Real-Time DVS Data Compression. In IEEE Asian Solid-State Circuits Conference, A-SSCC 2023, Haikou, China, November 5-8, 2023. pages 1-3, IEEE, 2023. [doi]
@inproceedings{KrishnanNOANHYKSSC23,
title = {3D-ISC: A 65nm 3D Compatible In-Sensor Computing Accelerator with Reconfigurable Tile Architecture for Real-Time DVS Data Compression},
author = {Gokul Krishnan and Gopikrishnan Raveendran Nair and Jonghyun Oh and Anupreetham Anupreetham and Pragnya Sudershan Nalla and Ahmed Hassan and Injune Yeo and Kishore Kasichainula and Jae-sun Seo and Mingoo Seok and Yu Cao},
year = {2023},
doi = {10.1109/A-SSCC58667.2023.10347978},
url = {https://doi.org/10.1109/A-SSCC58667.2023.10347978},
researchr = {https://researchr.org/publication/KrishnanNOANHYKSSC23},
cites = {0},
citedby = {0},
pages = {1-3},
booktitle = {IEEE Asian Solid-State Circuits Conference, A-SSCC 2023, Haikou, China, November 5-8, 2023},
publisher = {IEEE},
isbn = {979-8-3503-3003-8},
}