Gokul Krishnan, Gopikrishnan Raveendran Nair, Jonghyun Oh, Anupreetham Anupreetham, Pragnya Sudershan Nalla, Ahmed Hassan, Injune Yeo, Kishore Kasichainula, Jae-sun Seo, Mingoo Seok, Yu Cao. 3D-ISC: A 65nm 3D Compatible In-Sensor Computing Accelerator with Reconfigurable Tile Architecture for Real-Time DVS Data Compression. In IEEE Asian Solid-State Circuits Conference, A-SSCC 2023, Haikou, China, November 5-8, 2023. pages 1-3, IEEE, 2023. [doi]
Abstract is missing.