Attaining Thermal Integrity in Nanometer Chips

Ja Chun Ku, Yehea I. Ismail. Attaining Thermal Integrity in Nanometer Chips. In International Symposium on Circuits and Systems (ISCAS 2007), 27-20 May 2007, New Orleans, Louisiana, USA. pages 3223-3226, IEEE, 2007. [doi]

Abstract

Abstract is missing.