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Invited: Addressing Electromigration Challenges in 3D Integrated Circuit (3DIC) Wafer-On-Wafer Technology: EM analysis in 3DIC - status and challenges

Ingo Kühn, Ivan Valentinov Petkov. Invited: Addressing Electromigration Challenges in 3D Integrated Circuit (3DIC) Wafer-On-Wafer Technology: EM analysis in 3DIC - status and challenges. In Stephan Held, Rickard Ewetz, Tung-Chieh Chen, Gracieli Posser, editors, Proceedings of the 2026 International Symposium on Physical Design, ISPD 2026, BonnGermany, March 15-18, 2026. pages 201-202, ACM, 2026. [doi]

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