Frequency response and transient analysis of through glass packaging vias using matrix-rational approximation (MRA) technique for three-dimensional ICs

Ajay Kumar, Rohit Dhiman. Frequency response and transient analysis of through glass packaging vias using matrix-rational approximation (MRA) technique for three-dimensional ICs. Microelectronics Journal, 141:105941, November 2023. [doi]

Abstract

Abstract is missing.