Vivek Kumar, Jyoti Patel, Arnab Datta, Sudeb Dasgupta. FEM Modeling of Thermal Aspect of Dielectric Inserted Under Source & Drain of 5 nm Nanosheet. In Ambika Prasad Shah, Sudeb Dasgupta, Anand D. Darji, Jaynarayan T. Tudu, editors, VLSI Design and Test - 26th International Symposium, VDAT 2022, Jammu, India, July 17-19, 2022, Revised Selected Papers. Volume 1687 of Communications in Computer and Information Science, pages 3-11, Springer, 2022. [doi]
@inproceedings{KumarPDD22,
title = {FEM Modeling of Thermal Aspect of Dielectric Inserted Under Source & Drain of 5 nm Nanosheet},
author = {Vivek Kumar and Jyoti Patel and Arnab Datta and Sudeb Dasgupta},
year = {2022},
doi = {10.1007/978-3-031-21514-8_1},
url = {https://doi.org/10.1007/978-3-031-21514-8_1},
researchr = {https://researchr.org/publication/KumarPDD22},
cites = {0},
citedby = {0},
pages = {3-11},
booktitle = {VLSI Design and Test - 26th International Symposium, VDAT 2022, Jammu, India, July 17-19, 2022, Revised Selected Papers},
editor = {Ambika Prasad Shah and Sudeb Dasgupta and Anand D. Darji and Jaynarayan T. Tudu},
volume = {1687},
series = {Communications in Computer and Information Science},
publisher = {Springer},
isbn = {978-3-031-21514-8},
}