Vivek Kumar, Jyoti Patel, Arnab Datta, Sudeb Dasgupta. FEM Modeling of Thermal Aspect of Dielectric Inserted Under Source & Drain of 5 nm Nanosheet. In Ambika Prasad Shah, Sudeb Dasgupta, Anand D. Darji, Jaynarayan T. Tudu, editors, VLSI Design and Test - 26th International Symposium, VDAT 2022, Jammu, India, July 17-19, 2022, Revised Selected Papers. Volume 1687 of Communications in Computer and Information Science, pages 3-11, Springer, 2022. [doi]
Abstract is missing.