TSV and DFT cost aware circuit partitioning for 3D-SOCs

Amit Kumar, Sudhakar M. Reddy, Irith Pomeranz, Bernd Becker. TSV and DFT cost aware circuit partitioning for 3D-SOCs. In Keith A. Bowman, Kamesh V. Gadepally, Pallab Chatterjee, Mark M. Budnik, Lalitha Immaneni, editors, Thirteenth International Symposium on Quality Electronic Design, ISQED 2012, Santa Clara, CA, USA, March 19-21, 2012. pages 21-26, IEEE, 2012. [doi]

@inproceedings{KumarRPB12,
  title = {TSV and DFT cost aware circuit partitioning for 3D-SOCs},
  author = {Amit Kumar and Sudhakar M. Reddy and Irith Pomeranz and Bernd Becker},
  year = {2012},
  doi = {10.1109/ISQED.2012.6187469},
  url = {http://dx.doi.org/10.1109/ISQED.2012.6187469},
  researchr = {https://researchr.org/publication/KumarRPB12},
  cites = {0},
  citedby = {0},
  pages = {21-26},
  booktitle = {Thirteenth International Symposium on Quality Electronic Design, ISQED 2012, Santa Clara, CA, USA, March 19-21, 2012},
  editor = {Keith A. Bowman and Kamesh V. Gadepally and Pallab Chatterjee and Mark M. Budnik and Lalitha Immaneni},
  publisher = {IEEE},
  isbn = {978-1-4673-1034-5},
}