David S. Kung, Ruchir Puri. CAD challenges for 3D ICs. In Proceedings of the 14th Asia South Pacific Design Automation Conference, ASP-DAC 2009, Yokohama, Japan, January 19-22, 2009. pages 421-422, IEEE, 2009. [doi]
@inproceedings{KungP09,
title = {CAD challenges for 3D ICs},
author = {David S. Kung and Ruchir Puri},
year = {2009},
doi = {10.1145/1509633.1509737},
url = {http://doi.acm.org/10.1145/1509633.1509737},
researchr = {https://researchr.org/publication/KungP09},
cites = {0},
citedby = {0},
pages = {421-422},
booktitle = {Proceedings of the 14th Asia South Pacific Design Automation Conference, ASP-DAC 2009, Yokohama, Japan, January 19-22, 2009},
publisher = {IEEE},
isbn = {978-1-4244-2748-2},
}