Atsushi Kurokawa, Toshiki Kanamoto, Tetsuya Ibe, Akira Kasebe, Wei Fong Chang, Tetsuro Kage, Yasuaki Inoue, Hiroo Masuda. Dummy Filling Methods for Reducing Interconnect Capacitance and Number of Fills. In 6th International Symposium on Quality of Electronic Design (ISQED 2005), 21-23 March 2005, San Jose, CA, USA. pages 586-591, IEEE Computer Society, 2005. [doi]
Abstract is missing.