Shunji Kurooka, Yoshinori Hotta, Ai Nakamura, Mitsumasa Koyanagi, Takafumi Fukushima. Cu-Cu Bonding Challenges with 'i-ACF' for Advanced 3D Integration. In 2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019. pages 1-4, IEEE, 2019. [doi]
@inproceedings{KurookaHNKF19,
title = {Cu-Cu Bonding Challenges with 'i-ACF' for Advanced 3D Integration},
author = {Shunji Kurooka and Yoshinori Hotta and Ai Nakamura and Mitsumasa Koyanagi and Takafumi Fukushima},
year = {2019},
doi = {10.1109/3DIC48104.2019.9058773},
url = {https://doi.org/10.1109/3DIC48104.2019.9058773},
researchr = {https://researchr.org/publication/KurookaHNKF19},
cites = {0},
citedby = {0},
pages = {1-4},
booktitle = {2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019},
publisher = {IEEE},
isbn = {978-1-7281-4870-0},
}