Shunji Kurooka, Yoshinori Hotta, Ai Nakamura, Mitsumasa Koyanagi, Takafumi Fukushima. Cu-Cu Bonding Challenges with 'i-ACF' for Advanced 3D Integration. In 2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019. pages 1-4, IEEE, 2019. [doi]
Abstract is missing.