Ding-Ming Kwai, Ka-Yi Yeh. Developing through-silicon stacking process using 3-D CMOS imager as a test vehicle. In International SoC Design Conference, ISOCC 2011, Jeju, South Korea, November 17-18, 2011. pages 124-126, IEEE, 2011. [doi]
@inproceedings{KwaiY11,
title = {Developing through-silicon stacking process using 3-D CMOS imager as a test vehicle},
author = {Ding-Ming Kwai and Ka-Yi Yeh},
year = {2011},
doi = {10.1109/ISOCC.2011.6138662},
url = {http://dx.doi.org/10.1109/ISOCC.2011.6138662},
researchr = {https://researchr.org/publication/KwaiY11},
cites = {0},
citedby = {0},
pages = {124-126},
booktitle = {International SoC Design Conference, ISOCC 2011, Jeju, South Korea, November 17-18, 2011},
publisher = {IEEE},
isbn = {978-1-4577-0709-4},
}