Developing through-silicon stacking process using 3-D CMOS imager as a test vehicle - researchr publication

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Ding-Ming Kwai, Ka-Yi Yeh. Developing through-silicon stacking process using 3-D CMOS imager as a test vehicle. In International SoC Design Conference, ISOCC 2011, Jeju, South Korea, November 17-18, 2011. pages 124-126, IEEE, 2011. [doi]

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