External Links

Cite Key

Statistics

  • References: 0
  • Cited by: 0
  • Reviews: 0
  • Bibliographies: 0

PDF

Researchr

Researchr is a web site for finding, collecting, sharing, and reviewing scientific publications, for researchers by researchers.

Sign up for an account to create a profile with publication list, tag and review your related work, and share bibliographies with your co-authors.

Electromigration of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite flip-chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy

Yi-Shao Lai, Kuo-Ming Chen, Chin-Li Kao, Chiu-Wen Lee, Ying-Ta Chiu. Electromigration of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite flip-chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy. Microelectronics Reliability, 47(8):1273-1279, 2007. [doi]

Authors

Yi-Shao Lai

This author has not been identified. Look up 'Yi-Shao Lai' in Google

Kuo-Ming Chen

This author has not been identified. Look up 'Kuo-Ming Chen' in Google

Chin-Li Kao

This author has not been identified. Look up 'Chin-Li Kao' in Google

Chiu-Wen Lee

This author has not been identified. Look up 'Chiu-Wen Lee' in Google

Ying-Ta Chiu

This author has not been identified. Look up 'Ying-Ta Chiu' in Google
runs on