Yi-Shao Lai, Kuo-Ming Chen, Chin-Li Kao, Chiu-Wen Lee, Ying-Ta Chiu. Electromigration of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite flip-chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy. Microelectronics Reliability, 47(8):1273-1279, 2007. [doi]
@article{LaiCKLC07,
title = {Electromigration of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite flip-chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy},
author = {Yi-Shao Lai and Kuo-Ming Chen and Chin-Li Kao and Chiu-Wen Lee and Ying-Ta Chiu},
year = {2007},
doi = {10.1016/j.microrel.2006.09.023},
url = {http://dx.doi.org/10.1016/j.microrel.2006.09.023},
researchr = {https://researchr.org/publication/LaiCKLC07},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {47},
number = {8},
pages = {1273-1279},
}