Chieh-Ming Lai, Yean-Kuen Fang, Chien Ting Lin, Chia-Wei Hsu, Wen-Kuan Yeh. The impacts of high tensile stress CESL and geometry design on device performance and reliability for 90 nm SOI nMOSFETs. Microelectronics Reliability, 47(6):944-952, 2007. [doi]
@article{LaiFLHY07,
title = {The impacts of high tensile stress CESL and geometry design on device performance and reliability for 90 nm SOI nMOSFETs},
author = {Chieh-Ming Lai and Yean-Kuen Fang and Chien Ting Lin and Chia-Wei Hsu and Wen-Kuan Yeh},
year = {2007},
doi = {10.1016/j.microrel.2006.06.010},
url = {http://dx.doi.org/10.1016/j.microrel.2006.06.010},
tags = {reliability, design},
researchr = {https://researchr.org/publication/LaiFLHY07},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {47},
number = {6},
pages = {944-952},
}