The impacts of high tensile stress CESL and geometry design on device performance and reliability for 90 nm SOI nMOSFETs

Chieh-Ming Lai, Yean-Kuen Fang, Chien Ting Lin, Chia-Wei Hsu, Wen-Kuan Yeh. The impacts of high tensile stress CESL and geometry design on device performance and reliability for 90 nm SOI nMOSFETs. Microelectronics Reliability, 47(6):944-952, 2007. [doi]

Abstract

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