Structural design guideline to minimize extreme low-k delamination potential in 40 nm flip-chip packages - researchr publication authors

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Yi-Shao Lai, Meng-Kai Shih, Chang-Chi Lee, Tong Hong Wang. Structural design guideline to minimize extreme low-k delamination potential in 40 nm flip-chip packages. Microelectronics Reliability, 52(11):2851-2855, 2012. [doi]

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