Structural design guideline to minimize extreme low-k delamination potential in 40 nm flip-chip packages

Yi-Shao Lai, Meng-Kai Shih, Chang-Chi Lee, Tong Hong Wang. Structural design guideline to minimize extreme low-k delamination potential in 40 nm flip-chip packages. Microelectronics Reliability, 52(11):2851-2855, 2012. [doi]

Abstract

Abstract is missing.