Yi-Shao Lai, Ping-Feng Yang, Chang-Lin Yeh. Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition. Microelectronics Reliability, 46(2-4):645-650, 2006. [doi]
@article{LaiYY06,
title = {Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition},
author = {Yi-Shao Lai and Ping-Feng Yang and Chang-Lin Yeh},
year = {2006},
doi = {10.1016/j.microrel.2005.07.005},
url = {http://dx.doi.org/10.1016/j.microrel.2005.07.005},
tags = {testing, reliability},
researchr = {https://researchr.org/publication/LaiYY06},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {46},
number = {2-4},
pages = {645-650},
}