Applying Universal Chip Telemetry to Detect Latent Defects and Aging in Advanced Electronics

Evelyn Landman, Alex Burlak, C. Nir Sever, Marc Hutner. Applying Universal Chip Telemetry to Detect Latent Defects and Aging in Advanced Electronics. In IEEE International Reliability Physics Symposium, IRPS 2022, Dallas, TX, USA, March 27-31, 2022. pages 38-1, IEEE, 2022. [doi]

Abstract

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