Unified 3D-IC Multi-Chiplet System Design Solution

Wang-Tyng Lay. Unified 3D-IC Multi-Chiplet System Design Solution. In Iris Hui-Ru Jiang, Gracieli Posser, editors, Proceedings of the 2024 International Symposium on Physical Design, ISPD 2024, Taipei, Taiwan, March 12-15, 2024. pages 83, ACM, 2024. [doi]

Abstract

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